JPH058102Y2 - - Google Patents
Info
- Publication number
- JPH058102Y2 JPH058102Y2 JP9102288U JP9102288U JPH058102Y2 JP H058102 Y2 JPH058102 Y2 JP H058102Y2 JP 9102288 U JP9102288 U JP 9102288U JP 9102288 U JP9102288 U JP 9102288U JP H058102 Y2 JPH058102 Y2 JP H058102Y2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- molding
- mold
- resin
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 39
- 239000012778 molding material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001315 Tool steel Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9102288U JPH058102Y2 (en]) | 1988-07-11 | 1988-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9102288U JPH058102Y2 (en]) | 1988-07-11 | 1988-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0212815U JPH0212815U (en]) | 1990-01-26 |
| JPH058102Y2 true JPH058102Y2 (en]) | 1993-03-01 |
Family
ID=31315523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9102288U Expired - Lifetime JPH058102Y2 (en]) | 1988-07-11 | 1988-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058102Y2 (en]) |
-
1988
- 1988-07-11 JP JP9102288U patent/JPH058102Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0212815U (en]) | 1990-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5254501A (en) | Same-side gated process for encapsulating semiconductor devices | |
| JPH058102Y2 (en]) | ||
| JPH06328518A (ja) | 金型におけるロック装置 | |
| CN210283003U (zh) | 一种模内嵌件注塑的固定机构 | |
| JP3421948B2 (ja) | アンダーカット部を有する椀状物品の射出成形方法 | |
| CN204977298U (zh) | 半导体塑封模具的芯片载体夹持结构及半导体塑封模具 | |
| JP2003324116A (ja) | 樹脂封止金型および樹脂封止装置 | |
| JP3074340B2 (ja) | 電子部品の樹脂封止成形方法及び金型 | |
| CN217144765U (zh) | 一种应用于模具的顶出机构 | |
| JPH05237864A (ja) | 樹脂封止型半導体装置の製造方法及びそれに用いる治具 | |
| JPH0229314A (ja) | モールド金型 | |
| JPH08108455A (ja) | 半導体樹脂封止用金型 | |
| JP2000127177A (ja) | 筒状成形品の成形装置 | |
| JP2992982B2 (ja) | 電子部品の樹脂封止部成形用金型装置 | |
| JPH0812877B2 (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPH0153501B2 (en]) | ||
| JP2585093B2 (ja) | 直圧成形のバリ除去方法 | |
| JPH1022314A (ja) | 半導体樹脂封止用金型 | |
| JP2502387B2 (ja) | 半導体素子の樹脂封止方法及び樹脂封止金型 | |
| JPH0740375A (ja) | ガスケットの製造方法 | |
| JP2842272B2 (ja) | 半導体装置の樹脂封止方法及びその封止装置 | |
| JPH0994834A (ja) | 樹脂成形装置およびそれを用いて製造した半導体集積回路装置 | |
| KR950005448B1 (ko) | 플라스틱 패키지 몰드 방출 장치 | |
| JPH0259309A (ja) | モールド金型 | |
| JPS63151417A (ja) | 圧縮成形金型 |